unprecedented expansion, competition in big trouble

The TSMC company is significantly accelerating the development and production of new generation chips. The giant from Taiwan is launching as many as five modern factories that are entering the phase of increasing production, which represents one of the most ambitious expansions in the history of the company, but also of this industry in general.

At a recent technology symposium in Silicon Valley, the company’s management confirmed that plans are being implemented at twice the pace of previous projects. The new 2 nm production process has already entered the mass production phase, and according to the company, the improvement curve of the production yield is better than that of the previous 3 nm generation, despite the more complex “nanosheet” architecture.

TSMC accelerates 2 nm production with five factories

Huge demand for chips, especially in the artificial intelligence and high-performance segments, continues to exceed production capacity. Major technology players such as NVIDIA, Apple, Qualcomm and AMD have already secured significant production volumes on the new 2nm process, with Apple reportedly holding more than half of the initial capacity.

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For the first time, TSMC is introducing new production processes in multiple factories at the same time, which was not the case before. Thanks to this, an increase in production capacity of up to 45% is expected compared to the period when 3 nm technology was in the introduction phase.

The company additionally plans to build and modernize nine factories per year, which practically doubles the pace of expansion. Production is also increasing in parallel in the existing facilities in the USA, Japan and Germany.

The demand for AI accelerators is growing by as much as 11 times, while interest in complex processors with advanced transistor packaging is growing six times. Thanks to the advancement of 3D packaging technology, the time required for mass production of SoIC chips has been reduced by as much as 75%.

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The total capacity of advanced chip packaging could increase by 80% by 2027, which further confirms that TSMC is entering a phase of accelerated growth and strengthening of dominance in the global semiconductor industry, reports Gizmochina.

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