The Honor Magic V5 was one of the most prominent bendable phones last year, and tipster Digital Chat Station now brings the first specifications of its successor: the Magic V6 model, which is expected to debut in China by mid-2026.
According to available information, the Magic V6 will use the Qualcomm Snapdragon 8 Elite Gen 5 chipset and bring significant improvements in battery capacity and extended operating autonomy.
More powerful chipset, bigger battery and new 200 MP camera for Magic V6
Honor is reportedly testing two battery configurations. The first version comes with a dual battery of 6,900 mAh and will most likely be launched on the international market.
The second model has an even larger double battery with a capacity of 7,200 mAh and is intended for the Chinese market. Although the charging speed is not known, both versions are confirmed to support wireless charging.
A big improvement is also coming in the field of cameras. The Magic V6 should get a 200 MP main camera, which fits in with earlier announcements, along with a periscope telephoto module with 3x optical zoom. Other information points to a side-mounted fingerprint sensor, improved protection against dust and water, as well as an even thinner design compared to the previous generation, reports GSM Arena.