Samsung is accelerating the development of its next-generation Exynos 2700 mobile processor, and according to new information, the first production samples of the chip have already begun.
This step comes after the presentation of the Exynos 2600 processor, which in some tests managed to surpass the competing Snapdragon 8 Elite Gen 5, especially in tasks related to natural language understanding, object detection and image classification.
The first samples of the Exynos 2700 chip are already in production
According to a South Korean media report, Samsung completed the design of the Exynos 2700 processor at the end of 2025, and has now started the production of the first test samples of this chip. This phase of development is expected to be completed by June 2026.
Mass production is planned for the second half of the year, which means that the processor could appear in the next generation of Galaxy phones.
Kiwoom Securities analyst Park Yu-ak estimates that the Exynos 2700 could take up about 50% of production in the Samsung Galaxy S27 series, provided the yields of Samsung’s 2nm manufacturing process are good enough.
In that case, Samsung could reduce its dependence on Qualcomm chips and processors like the Snapdragon 8 Elite Gen 6 Pro.
Unusual CPU configuration and new graphics
According to the information so far, the Exynos 2700 could use an interesting configuration of processor cores based on the ARM C2 architecture:
4 cores at 2.88 GHz
1 core at 2.78 GHz
4 cores at 2.40 GHz
1 core at 2.30 GHz
The graphics part should be Xclipse 970, which could be based on a modified version of AMD’s RDNA 5 architecture.
Support for LPDDR6 memory and UFS 5.0 storage is also expected.
New cooling solutions
Samsung is also reportedly developing a new heat dissipation solution called Side-by-Side (Sb), which arranges chips horizontally instead of in layers. In addition, a special copper heat dissipation solution called Heat Path Block is used.
The goal is to improve the thermal stability of the processor and enable higher performance without overheating, which is crucial for modern mobile processors with powerful AI and graphics capabilities, reports Wccftech.