According to new information coming from the iPhone Fold component supplier chain, Apple plans to use a material with advanced features for its first flip phone, i.e. liquid metal for the hinge mechanism, as well …
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According to new information coming from the iPhone Fold component supplier chain, Apple plans to use a material with advanced features for its first flip phone, i.e. liquid metal for the hinge mechanism, as well …
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AMD is actively working on the next generation of EXPO 1.20 memory technology, aimed at improved DDR5 OC profiles and better optimization for the AM5 platform. The first traces of this version were discovered in …
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